ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,153, issued on July 14, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Sensor for thermal dissipation measurement" ... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,154, issued on July 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package" was invented by Jongg... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,155, issued on July 14, was assigned to SILICONWARE PRECISION INDUSTRIES Co. LTD. (Taichung City, Taiwan). "Electronic package and substrat... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,156, issued on July 14, was assigned to Amkor Technology Singapore Holding Pte. Ltd. (Singapore). "Electronic devices and methods of manufa... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,157, issued on July 14, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Etching-damage-free intermetal ... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,158, issued on July 14, was assigned to DENKA COMPANY Ltd. (Tokyo). "Heat dissipation member" was invented by Daisuke Goto (Tokyo) and Hiro... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,159, issued on July 14, was assigned to Microsoft Technology Licensing LLC (Redmond, Wash.). "3D integrated chips with microfluidic cooling... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,160, issued on July 14, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package and semiconductor devi... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,161, issued on July 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Glass-based cavity and channels for cooling of embedded dies an... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,162, issued on July 14, was assigned to Mitsubishi Electric Corp. (Tokyo). "Cooler and semiconductor device" was invented by Naoki Yoshimat... Read More